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SUMMARY:Printed Circuit Board Design for EMC and Signal Integrity
DESCRIPTION:Today's rapid development cycles require products to meet their
  EMC requirements the first time they come into the lab for testing. Board
  layout changes and other EMC \"fixes\" can significantly add to the cost 
 of a product and/or delay its development schedule. First-pass compliance 
 with EMC requirements starts with the circuit board layout. Printed circui
 t board layout is often the single most important factor affecting the ele
 ctromagnetic compatibility of electronic systems. Boards that are auto-rou
 ted or laid out according to a list of “design rules” do not usually m
 eet electromagnetic compatibility requirements on the first pass\; and the
  products using these boards are more likely to require expensive fixes su
 ch as ferrites on cables or shielded enclosures. Taking the time to ensure
  that components are properly placed\, transition times are not left to ch
 ance\, and traces are optimally routed will generally result in products t
 hat meet all electromagnetic compatibility and signal integrity requiremen
 ts on time and on budget.
 Recognizing poor design features early in a pr
 oduct’s development can save a lot of time and expense later on. This co
 urse stresses the fundamental concepts and tools that board designers must
  be familiar with to avoid electromagnetic compatibility and signal integr
 ity problems. Students completing the course will be able to make good dec
 isions regarding component selection\, component placement\, and trace rou
 ting. In addition\, students will have the knowledge and tools necessary t
 o design effective power distribution and grounding strategies for both di
 gital and mixed-signal boards.
DTSTART:20260928T050000Z
DTEND:20261008T050000Z
DTSTAMP:20260428T010202Z
ORGANIZER;CN=Nancy Hubing:MAILTO:nancy@learnemc.com
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